John Ferguson reviews the key capital metrics you need to review when deciding whether to move to a new process.
These days, when it comes to innovation: The car's the star - not the stooge.
Monolithic 3DIC integration may provide a viable alternative to conventional 2D scaling for SoCs if manufacturing problems can be overcome.
The costs of advanced lithography techniques at 1xnm, and the yield and reliability risks from the resultant process variation, will stop many companies getting the typical economic advantages of scaling.
The single core processor is reaching its performance ceiling, due to energy, thermal and power concerns. To address these issues that cause design difficulties, many embedded designers are migrating embedded applications from single core to multicore. This article provides an outline for a software strategy to progress from one core to two and beyond using [...]
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